Sharma Design of 3D Integrated Circuits and Systems

1. Auflage 2018
ISBN: 978-1-4665-8942-1
Verlag: Taylor & Francis
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 324 Seiten

Reihe: Devices, Circuits, and Systems

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity.

Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text:

- Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer

- Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs)

- Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs)

- Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications

- Describes large-scale integration testing and state-of-the-art low-power testing solutions

Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Zielgruppe

Researchers, industry designers, and graduate students.

Autoren/Hrsg.

Sharma, Rohit

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise

Inhaltsverzeichnis

Preface

About the Editors

Contributors

3D Integration Technology with TSV and IMC Bonding; Katsuyuki Sakuma

Wafer-Level Three-Dimensional ICs for Advanced CMOS Integration; Ronald J. Gutmann and Jian-Qiang Lu

Integration of Graphics Processing Cores with Microprocessors; Deepak C. Sekar and Chinnakrishnan Ballapuram

Electrothermal Simulation of Three-Dimensional Integrated Circuits; Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis

Thermal Management in 3D ICs/Systems; Francesco Zanini

Emerging Interconnect Technologies for 3D Networks-on-Chip; Rohit Sharma and Kiyoung Choi

Inductive-Coupling ThruChip Interface for 3D Integration; Noriyuki Miura and Tadahiro Kuroda

Fabrication and Modeling of Copper and Carbon Nanotube-Based Through-Silicon Via; Brajesh Kumar Kaushik, Manoj Kumar Majumder, and Archana Kumari

Low-Power Testing for 2D/3D Devices and Systems; Xijiang Lin, Xiaoqing Wen, and Dong Xiang

Über Autor(innen)

Rohit Sharma is faculty at the Indian Institute of Technology Ropar, Punjab. He previously worked as a post-doctoral researcher at Seoul National University, South Korea and at Georgia Institute of Technology, Atlanta, USA. Dr. Sharma has authored/co-authored over 50 journal and conference publications, one book, one book chapter, two patents/copyrights, and several invited talks. He was a recipient of the Brain Korea Research Fellowship (2010), the Indo-US Research Fellowship (2011), and Best Paper Awards in ASQED 2010 and GIT 2011 conferences. An IEEE and ACM member, he has served as a journal referee and committee member/session co-chair on multiple occasions.