Sonstiges, Englisch, 220 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g
Sonstiges, Englisch, 220 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g
ISBN: 978-3-03859-704-9
Verlag: Trans Tech Publications
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Weitere Infos & Material
Essential Aspects of Chemical Mechanical Planarization for Oxide SemiconductorA Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing ProcessSome Essentials of Simulating Nano-Surfacing Processes Using the Molecular Dynamics MethodAssessment of the Exit Defects in Carbon Fibre-Reinforced Plastic Plates Caused by DrillingGrinding of Ceramics: Strength, Surface Features and Grinding ConditionsGrinding Burn Mechanism of Directionally Solidified SuperalloyWear Mechanism of Diamond Cutting Tool in Machining of SteelA Friction Model for Free-Machining Steels and Its Applicability to Machinability AnalysisImprovement of Friction and Wear Properties of CVD-SiC Films with New Surface Finishing Method 'ELID-Grinding'A New Device of Abrasive Jet Machining and Application to Abrasive Jet PrinterOn-Machine Monitoring of the Wheel-Working Surface Condition with the Relative Frequency Distribution of its ProfileOn-Machine Monitoring of the Wheel Working Surface Condition with the Fractal Dimension Analysis of Its ProfileFabrication of Metal-Bonded Grinding/Polishing Tools by Greentape Laser Sintering MethodAbrasive Capacity of Thin Film Diamond StructuresMicro Hole Machining of Borosilicate Glass through Electrochemical Discharge Machining (ECDM)Micro-Spherical Lens Mold Fabrication by Cup-Type Metal-Bond Grinding Wheels Applying ELID (Electrolytic In-Process Dressing)Threading of Inclusion Modified Steels with Coated Carbide ToolsCVD Diamond Coating Technologies and Application in Cutting Abrasive Materials