Lerch / Niess | Rapid Thermal Processing and beyond: Applications in Semiconductor Processing | Sonstiges | 978-3-908453-41-3 | sack.de

Sonstiges, Englisch, 448 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g

Lerch / Niess

Rapid Thermal Processing and beyond: Applications in Semiconductor Processing


Erscheinungsjahr 2008
ISBN: 978-3-908453-41-3
Verlag: Trans Tech Publications

Sonstiges, Englisch, 448 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g

ISBN: 978-3-908453-41-3
Verlag: Trans Tech Publications


Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging and is still a field ripe for further development.
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Weitere Infos & Material


The Expanding Role of Rapid Thermal Processing in CMOS ManufacturingEvolution of Commercial RTP ModulesFast Diffusion in Germanium and Silicon Investigated by Lamp-Based Rapid Thermal AnnealingRapid Thermal Processing and the Control of Oxygen Precipitation Behaviour in Silicon WafersHigh Temperature RTP Application in SOI ManufacturingCleaning of Silicon Surfaces for NanotechnologyHeavy Water in Gate Stack ProcessingAdvanced Gate Dielectric Development for VLSI TechnologyA Growth Kinetics Model for the Radical Oxidation of SiliconInvestigation of Ultra Thin Thermal Nitrided Gate Dielectrics in Comparison to Plasma Nitrided Gate Dielectrics for High-Performance Logic Application for 65nmHigh-K: Latest Developments and PerspectivesProduction Worthy ALD in Batch ReactorsUltra Shallow Depth Profiling with SIMSImplant Annealing ? An Evolution from Soak over Spike to Millisecond AnnealingA Light-Induced Annealing of Silicon Implanted LayersLaser Annealing of Implanted Semiconductor Layers ? One Bridge to Nano-ProcessingAn Overview of ms Annealing for Deep Sub-Micron ActivationExtended Defects Evolution in Pre-Amorphised Silicon after Millisecond Flash AnnealsModeling and Simulation of Advanced Annealing ProcessesVacancy Engineering ? An Ultra-Low Thermal Budget Method for High-Concentration 'Diffusionless' Implantation DopingUltra-Shallow Junction Formation Using Rapid Thermal ProcessingUltra-Rapid Thermal Process for ULSIsAdvanced Millisecond Annealing Technologies and its Applications and Concerns on Advanced Logic LSI Fabrication Processes Doping Strategies for FinFETsRTP Requirements for CMOS Integration of Dual Work Function Phase Controlled Ni-FUSI (Fully Silicided) Gates with Simultaneous Silicidation of nMOS (NiSi) and pMOS (Ni-Rich Silicide) Gates on HfSiONA Short History of Pattern Effects in Thermal ProcessingConduction Heating in RTP Fast, and Pattern-IndependentAdvanced Annealing Schemes for High-Performance SOI Logic TechnologiesModel Based Measurement in Advanced Rapid Thermal ProcessingShort Time Thermal Processing: From Electronics via Photonics to Pipe Organs of the 17th Century


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